TSpace^™XP

New Surface. New Level of Fusion.

The TSpace^XP Interbody System brings our innovative Plasmapore^®XP Surface Enhancing Technology to TLIF procedures. The combination of a PEEK-OPTIMA^®* core with the osteoconductive Plasmapore^XP surface delivers enhanced implant stability, artifact-free visualization and proven biocompatibility.^*

System Features

• Radiolucent PEEK-OPTIMA core treated with osteoconductive Plasmapore^XP pure porous titanium
• Chamfered leading edge and aggressive teeth to resist migration
• Uniform curve-shaped width that follows the anatomical curvature of the endplate
• Tantalum markers for easy identification of implant orientation
• Both rigid and articulating inserter options
• 30 implant variations to match patient anatomy
• Trials for each implant variation permit conformability in size selection for each patient

Plasmapore^XP Surface Enhancing Technology

To enhance osteoconductivity, Aesculap maximized 20 years of success in applying the Plasmapore surface to titanium orthopaedic and spine implants to develop the Plasmapore^XP surface technology for PEEK spinal implants. The porous surface delivers a number of operational advantages:

• Increased migration resistance⁺
• Enhanced implant stability⁺
• Increased bone formation⁺
• Early bone apposition⁺
• Excellent visibility during imaging⁺

_{^*PEEK-OPTIMA is a registered trademark of Invibio Biomaterial Solutions.
⁺Data on file.}